Transactions of Nonferrous Metals Society of China The Chinese Journal of Nonferrous Metals

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Transactions of Nonferrous Metals Society of China

Vol. 19    Special 2    September 2009

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Fabrication and thermo-physical properties of TiB2p/Cu composites for electronic packaging applications
CHEN Guo-qin(陈国钦)1, XIU Zi-yang(修子扬)2, MENG Song-he(孟松鹤)3,
WU Gao-hui(武高辉)1, ZHU De-zhi(朱德志)1

1. School of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001, China;
2. Academy of Fundamental and Interdisciplinary Sciences, Harbin Institute of Technology,
Harbin 150001, China;
3. Center for Composite Materials, Harbin Institute of Technology, Harbin 150001, China

Abstract:TiB2p/Cu composites with high reinforcement content (φp=50%, 58% and 65%) for electronic packaging applications were fabricated by squeeze casting technology. The microstructures and thermo-physical properties of the TiB2p/Cu composites were investigated. The results show that TiB2 particles are homogeneous and distribute uniformly, and the TiB2-Cu interfaces are clean and free-from interfacial reaction products and amorphous layers, the densifications of the TiB2p/Cu composites are higher than 98.2%. The mean linear coefficients of thermal expansion at 20−100 ℃ for TiB2p/Cu composites range from 8.3×10−6 to 10.8×10−6/K and decrease with increasing volume fraction of TiB2. The experimental coefficients of thermal expansion agree well with the predicted values based on Turner’s model. The thermal conductivities of TiB2p/Cu composites range from 167.3 to 215.4 W/(m∙K), decreasing with increasing volume fraction TiB2.


Key words: TiB2p/Cu composites; densification; coefficient of thermal expansion; thermal conductivity

ISSN 1004-0609
CN 43-1238/TG

ISSN 1003-6326
CN 43-1239/TG

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