Transactions of Nonferrous Metals Society of China The Chinese Journal of Nonferrous Metals

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中国有色金属学报

ZHONGGUO YOUSEJINSHU XUEBAO

第18卷    第7期    总第112期    2008年7月

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文章编号:1004-0609(2008)07-1242-06
Cu-Ni-Si-P合金的动态再结晶
张 毅1, 2,刘 平2,田保红3,陈小红1, 2,贾淑果3,任凤章3,龙永强3

(1. 西安理工大学 材料科学与工程学院,西安 710048;
2. 上海理工大学 机械工程学院,上海 200093;
3. 河南科技大学 材料科学与工程学院,洛阳 471003
)

摘 要:

在Gleeble−1500D热模拟实验机上,在应变速率为0.01~5 /s、变形温度为600~800 ℃条件下,采用高温等温压缩实验对Cu-2.0Ni-0.5Si-0.03P合金的流变应力行为进行研究。结果表明:热模拟实验中,应变速率和变形温度的变化强烈地影响合金流变应力的大小,流变应力随变形温度升高而降低,随应变速率提高而增大;在应变温度为750和800 ℃时,合金热压缩变形流变应力出现明显的峰值应力,表现为连续动态再结晶特征。从流变应力、应变速率和温度的相关性,得出该合金热压缩变形时的热变形激活能和本构方程。

 

关键字: Cu-2.0Ni-0.5Si-0.03P合金;热压缩变形;动态再结晶;本构方程

Dynamic recrystallization behavior of Cu-Ni-Si-P alloy
ZHANG Yi1, LIU Ping1, 2, TIAN Bao-hong3, CHEN Xiao-hong1, 2,
JIA Shu-guo3, REN Feng-zhang3, LONG Yong-qiang3

1. School of Materials Science and Engineering, Xi’an University of Technology, Xi’an 710048, China;
2. College of Mechanical Engineering, University of Shanghai for Science and Technology, Shanghai 200093, China;
3. School of Materials Science and Engineering, Henan University of Science and Technology, Luoyang 471003, China

Abstract:The flow stress behavior of Cu-2.0Ni-0.5Si-0.03P alloy during hot compression deformation was studied by isothermal compression test at Gleeble−1500D thermal-mechanical simulator at the temperature ranging from 600 ℃ to 800 ℃ and at the strain rate from 0.01 /s to 5 /s. The results show that the flow stress is controlled by both strain rate and deforming temperature, the flow stress decreases with increasing deforming temperature, while increases with increasing strain rate. When the deformation temperature is 750 and 800 ℃, the flow stress decreases after a peak value, showing continuous dynamic recrystallization. Both the hot deformation activation energy and constitutive equation were derived from the correlativity of flow stress, strain rate and temperature.

 

Key words: Cu-2.0Ni-0.5Si-0.03P alloy; hot compression deformation; dynamic recrystallization; constitutive equation

ISSN 1004-0609
CN 43-1238/TG
CODEN: ZYJXFK

ISSN 1003-6326
CN 43-1239/TG
CODEN: TNMCEW

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