Transactions of Nonferrous Metals Society of China The Chinese Journal of Nonferrous Metals

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Transactions of Nonferrous Metals Society of China

Vol. 24    No. 6    June 2014

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Stability of remelting and solidification interfaces of triple-phase region during peritectic reaction at lower speed
Shu-jie WANG1,2, Liang WANG1, Liang-shun LUO1, Yan-qing SU1, Fu-yu DONG1, Jing-jie GUO1, Heng-zhi FU1

1. School of Materials Science and Engineering, Harbin Institute of Technology, Harbin 150001, China;
2. Science and Technology on ASIC Laboratory, Hebei Semiconductor Research Institute, Shijiazhuang 050051, China

Abstract:Peritectic reaction was studied by directional solidification of Cu-Ge alloys. A larger triple junction region of peritectic reaction was used to analyze the interface stability of the triple junction region during peritectic reaction. Under different growth conditions and compositions, different growth morphologies of triple junction region are presented. For the hypoperitectic Cu-13.5%Ge alloy, as the pulling velocity (v) increases from 2 to 5 μm/s, the morphological instability of the peritectic phase occurs during the peritectic reaction and the remelting interface of the primary phase is relatively stable. However, for the hyperperitectic Cu-15.6%Ge alloy with v=5 μm/s, the nonplanar remelting interface near the trijunction is presented. The morphological stabilities of the solidifying peritectic phase and the remelting primary phase are analyzed in terms of the constitutional undercooling criterion.


Key words: peritectic reaction; Cu-Ge alloys; directional solidification; microstructure; constitutional undercooling

ISSN 1004-0609
CN 43-1238/TG

ISSN 1003-6326
CN 43-1239/TG

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