Transactions of Nonferrous Metals Society of China The Chinese Journal of Nonferrous Metals

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Transactions of Nonferrous Metals Society of China

Vol. 25    No. 3    March 2015

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Effects of Sn element on microstructure and properties of Zn-Cu-Bi-Sn high-temperature solder
Fei XING, Xiao-ming QIU, Yang-dong LI

Key Laboratory of Automobile Materials of Ministry of Education,
School of Materials Science and Engineering, Jilin University, Changchun 130025, China

Abstract:The microstructures and properties of the Zn-Cu-Bi-Sn (ZCBS) high-temperature solders with various Sn contents were studied using differential scanning calorimetry (DSC), scanning electron microscopy (SEM) and X-ray diffraction (XRD). The results indicate that the increase of Sn content can both decrease the melting temperature and melting range of ZCBS solders and it can also effectively improve the wettability on Cu substrate. The shear strength of solder joints reaches a maximum value with the Sn addition of 5% (mass fraction), which is attributed to the formation of refined β-Sn and primary ε-CuZn5 phases in η-Zn matrix. However, when the content of Sn exceeds 5%, the shear strength decreases due to the formation of coarse β-Sn phase, which is net-shaped presented at the grain boundary.


Key words: solder; Zn-based solder; Sn; high-temperature solder; thermal property; wettability

ISSN 1004-0609
CN 43-1238/TG

ISSN 1003-6326
CN 43-1239/TG

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