Transactions of Nonferrous Metals Society of China The Chinese Journal of Nonferrous Metals

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Transactions of Nonferrous Metals Society of China

Vol. 28    No. 7    July 2018

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Optimization of three-dimensional boiling enhancement structure at evaporation surface for high power light emitting diode
Jian-hua XIANG1, Chao ZHOU1, Chun-liang ZHANG1, Gui-yun LIU1, Cong-gui CHEN1, Wei ZHOU2

1. School of Mechanical and Electric Engineering, Guangzhou University, Guangzhou 510006, China;
2. Department of Mechanical and Electrical Engineering, Xiamen University, Xiamen 361005, China

Abstract:A theoretical model of phase change heat sink was established in terms of thermal resistance network. The influence of different parameters on the thermal resistance was analyzed and the crucial impact factors were determined. Subsequently, the forming methods including ploughing-extrusion and stamping method of boiling enhancement structure at evaporation surface were investigated, upon which three-dimensional microgroove structure was fabricated to improve the efficiency of evaporation. Moreover, the crucial parameters related to the fabrication of miniaturized phase change heat sink were optimized. The heat transfer performance of the heat sink was tested. Results show that the developed phase change heat sink has excellent heat transfer performance and is suitable for high power LED applications.


Key words: high power LED; phase change heat sink; ploughing-extrusion; boiling enhancement; three-dimensional microgroove

ISSN 1004-0609
CN 43-1238/TG

ISSN 1003-6326
CN 43-1239/TG

主管:中国科学技术协会 主办:中国有色金属学会 承办:中南大学
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