Transactions of Nonferrous Metals Society of China The Chinese Journal of Nonferrous Metals

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中国有色金属学报

ZHONGGUO YOUSEJINSHU XUEBAO

第29卷    第1期    总第238期    2019年1月

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文章编号:1004-0609(2019)-01-0054-12
高纯钽退火过程中储存能演变及其对再结晶行为的影响
祝佳林1,毛宇成2,刘施峰1,柳亚辉1,林 男1,邓 超1, 3

(1. 重庆大学 材料与科学工程学院,重庆 400044;
2. 北京航空航天大学 仪器科学与光电工程学院,北京 100191;
3. 重庆大学 电子显微镜中心,重庆 400044
)

摘 要: 将87%周向轧制钽板分别加热至700、800和900 ℃进行预回复处理,随后,将所有样品在1300℃保温30 min进行再结晶退火处理。应用X射线峰形分析(XLPA)定量计算经不同温度预回复处理后样品1/4厚度层的储存能。此外,利用电子背散射衍射(EBSD)和透射电子显微(TEM)技术表征了预回复和再结晶态样品的微观组织。结果表明:随着预回复温度的升高,一方面,亚晶数目逐渐增加;另一方面,{111}(111//ND(板法向))和{100}(100//ND)取向晶粒内部的储存能明显减小,且两者的比值也逐渐降低。因此,再结晶晶粒尺寸不断减小且晶粒形貌也趋近等轴状。但过高的预回复温度(900 ℃)使后续再结晶组织中出现了较强的{111}织构带,经过800℃预回复处理后的再结晶微观组织相对较为均匀,最有利于钽溅射靶材的应用。

 

关键词: 高纯钽;周向轧制;预回复温度;储存能;微观组织

Stored energy evolution of high-purity tantalum during annealing and its effect on recrystallization behavior
ZHU Jia-lin1, MAO Yu-cheng2, LIU Shi-feng1, LIU Ya-hui1, LIN Nan1, DENG Chao1, 3

1. College of Materials Science and Engineering, Chongqing University, Chongqing 400044, China;
2. School of Instrument Science and Opto-electronics, Beihang University, Beijing 100191, China;
3. Electron Microscopy Center of Chongqing University, Chongqing University, Chongqing 400044, China

Abstract:High-purity tantalum plates were clock rolled to 87% reduction in thickness. Then, the samples were heated up to 700, 800 and 900 ℃ in the furnace, respectively, and were all annealed at 1300 ℃ for 30 min to get the recrystallization microstructure. X-ray line profile analysis (XLPA) was adopted to quantify the bulk stored energy of a quarter of the thickness of tantalum plates at different pre-recovery temperatures, combing with the electron back-scattered diffraction (EBSD) and transmission electron microscopy (TEM) to characterize the pre-recovery and recrystallization microstructure. The results show that the number of subgrains increases gradually with the increase of pre-recovery temperature and the stored energy gap of {111} ([111]//ND, ND is normal direction) and {100} ([100]//ND) orientation grain decreased obviously, which effectively reduces the subsequent driving force of recrystallization. Therefore, the recrystallization grain size gradually decreases and the grain morphology is close to be equiaxed. However, the high pre-recovery temperature (900 ℃) leads to a strong {111} texture bands in recrystallization microstructure, while the recrystallization microstructure is relatively uniform through pre-recovering of 800 ℃, which is beneficial to the application of tantalum sputtering target.

 

Key words: high-purity tantalum; clock rolled; pre-recovery temperature; stored energy; microstructure

ISSN 1004-0609
CN 43-1238/TG
CODEN: ZYJXFK

ISSN 1003-6326
CN 43-1239/TG
CODEN: TNMCEW

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