Transactions of Nonferrous Metals Society of China The Chinese Journal of Nonferrous Metals

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中国有色金属学报

ZHONGGUO YOUSEJINSHU XUEBAO

第29卷    第1期    总第238期    2019年1月

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文章编号:1004-0609(2019)-01-0146-07
(CH3)3COOH-NaOH体系处理废弃电路板中焊锡技术
郭学益,刘子康,黄国勇

(中南大学 冶金与环境学院,长沙 410083)

摘 要: 研究了在(CH3)3COOH-NaOH体系中,废弃电路板焊锡的锡和铅的分离富集行为。系统分析了反应温度、溶液组成、NaOH浓度、(CH3)3COOH滴加速度等因素对焊锡浸出效果的影响,得到最佳工艺参数如下:在溶液组成为85%的氢氧化钠与15%的(CH3)3COOH,反应温度为70 ℃条件下,当氢氧化钠溶液初始浓度为5 mol/L,(CH3)3COOH滴加速度为2.4 mL/min,浸出时间为20 min时,锡的浸出率为96.21%,铅的浸出率为92.36%。往退锡后液中加入理论量1.5倍的Na2S?9H2O,铅的沉淀率为98.79%,可制得纯度为99.23%的PbS产品;往沉淀后液中加入理论量2.5倍的Ca(OH)2,锡的沉淀率达到93.21%,热处理后可得到SnO2产品,产品符合GB/T 26013—2010标准。

 

关键词: 废电路板;焊锡;(CH3)3COOH;NaOH

Recovery of solder from waste printed circuit boards in (CH3)3COOH-NaOH system
GUO Xue-yi, LIU Zi-kang, HUANG Guo-yong

School of Metallurgy and Environment, Central South University, Changsha 410083, China

Abstract:In the (CH3)3COOH-NaOH system, the separation and enrichment of tin and lead in solder in waste circuit board are studied. The impacts of leaching temperature, solution composition, NaOH concentration and dropping speed of (CH3)3COOH on solder extraction were systematically analysed. The optimum parameters for leaching are as follows: under the conditions of the solution consisting 85% of NaOH and 15% of (CH3)3COOH and leaching temperature of 70 ℃, when NaOH concentration is 5 mol/L, dropping speed of (CH3)3COOH is 2.4 mL/min and leaching time is 20 min, the leaching rates of lead and tin reach 98.79% and 99.23% respectively. After adding 1.5 times the theoretical amount of Na2S 9H2O to the solution, the precipitation rate of lead reaches 98.79%, the purity of 99.23% of PbS products are obtained. After adding 2.5 times the theoretical amount of Ca(OH)2 to the solution, the precipitation rate of tin reaches 93.21%, SnO2 products can be obtained after the heat treatment, which meet the GB / T 26013—2010 standard.

 

Key words: waste printed circuit board; solder; tert-butyl hydroperoxide; sodium hydroxide

ISSN 1004-0609
CN 43-1238/TG
CODEN: ZYJXFK

ISSN 1003-6326
CN 43-1239/TG
CODEN: TNMCEW

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