Transactions of Nonferrous Metals Society of China The Chinese Journal of Nonferrous Metals

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Transactions of Nonferrous Metals Society of China

Vol. 31    No. 8    August 2021

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Effect of transient current bonding on interfacial reaction in Ag-coated graphene Sn-Ag-Cu composite solder joints
Yong-dian HAN1,2, Jia-hang YANG1,2, Lian-yong XU1,2, Hong-yang JING1,2, Lei ZHAO1,2

1. School of Materials Science and Engineering, Tianjin University, Tianjin 300350, China;
2. Tianjin Key Laboratory of Advanced Joining Technology, Tianjin 300350, China

Abstract:To address the problem of floating and aggregation of Ag-GNSs in the molten pool during the traditional reflow soldering process, Cu/SAC/Ag-GNSs/Cu sandwich joints were prepared under an applied current density (1.0×104 A/cm2) for a few hundred milliseconds to produce Ag-coated graphene-reinforced Sn-Ag-Cu (SAC/Ag- GNSs) solder joints. The experimental results showed that Ag-GNSs were homogenously dispersed in the solder joints, providing more Cu6Sn5 grain nucleation sites, which refined these grains and reduced the thickness difference at the anode and cathode. In addition, the Cu6Sn5 morphology changed from rod-like to plate-shaped because of the uniform distribution of Ag-GNSs and constitutional supercooling. The significantly increased shear strength of the transient current bonding and the change in the fracture mechanism were due to the uniformly distributed Ag-GNSs and the microstructural changes.


Key words: transient current bonding; Ag-GNS; Cu6Sn5; shear strength

ISSN 1004-0609
CN 43-1238/TG

ISSN 1003-6326
CN 43-1239/TG

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